Advanced Comprehensive AOI Platform
At the core of all advanced SEMICON & EMS AOI lies Synthia AI Suite, which powers advanced 2D+3D inspection, smart programming, and vision intelligence in one unified AOI platform.
MAIN APP
ALGORITHM EDITOR
RESULT VIEWER
AI VISION
Advanced 6-sided 2D + 3D AOI for EMS Industry
6DF enables comprehensive 6-sided AOI inspection, covering the top, bottom, left, right, front, and rear surfaces of a product in a single inspection workflow.
This allows manufacturers to inspect not only the main board surface, but also side-mounted components, connectors, solder joints, labels, screws, ports, cables, mechanical parts, and hidden assembly areas that are often missed by conventional top-view inspection systems.
Final Assembly & Functional Module
LED, Sensor & Automotive Board
Through-hole & Mix Assemblies
Press-fit & Connector Assemblies
NV6 Pro
High-speed gantry-based AOI system designed for final-stage electronics inspection.
Auto-generated scanning paths from CAD files for faster setup compared to traditional robot arm systems.
6 vision station modules with 2D+3D capability for multi-angle inspection.
Simultaneous all-side image capture to improve inspection speed and reduce cycle time.
Angled cameras help detect defects that are difficult to identify from top-view inspection alone.
Multi-color directional lighting improves contrast and image clarity for accurate defect analysis.
3D structured light system enables measurement of height variation, warping, surface deformation, and dimensional defects.
Single-pass inspection capability combines 2D visual inspection and 3D measurement in one efficient scan.
Advanced 2D + 3D AOI for EMS Industry
3DF delivers exceptional performance through dual 3D methodologies, enabling reliable inspection of densely populated assemblies, complex geometries, and challenging surfaces, including highly reflective and low-contrast materials.
Comprehensive inspection coverage across a wide range of assembly processes:
Pre & Post-Reflow Photonics Transceiver Packaging
Wirebond
Broken/Damaged Wire
Bond Offset
Die Chip
Wirebond
Server Level
Board Level
Component Dent
LED Damage
PCB Peel Off
Solder Bridging
Pin Bent
Component Crack
Component Chip
Component Scratch
Excess Solder
Component Chip
Component Knock Off
PCB Scratch
Component Crack
Delamination
Component Raised
Screw Unflushed
Pin Height Measurement
Connector Pin Defects
Component Raised
BGA Balls
Pin Pressed Down
Wafer Bump
Pin Housing Measurement
Scratch
Foreign Material
Bad Screw Head
Connector Housing Damage
Label Scratches
Dent
Oil/Grease
Damage/Deformation
Label Peel Off/Damage
OCV/OCR
Rust
Missing Screw
Bent Pin
Label Contamination
Barcode Scanning
Let’s co-create your next operational breakthrough. Tell us about your vision inquiry, and our engineering team will design a high-precision, custom AI solution built for your exact needs.